System 650 Universal Bond Tester from Royce Instruments

Royce Instruments has launched what is known as System 650 universal bond tester. Tthe system 650 universal bond tester satisfies the demand for a dependable, compact test system with generous expandability to support advanced packaging requirements.

The System 650's quick start test modules permit rapid changeover between wire pull, tweezer pull, ball bond shear, cold ball pull or die shear tests. The high resolution motion control system is precise enough to repeatably deliver less than 1 micron bond shear heights, yet is robust enough to shear large die up to 200 Kgf (440 lbf). A large 305 mm x 155 mm servo driven XY stage permits testing of 300mm wafers, leadframes, large substrates or PC boards.

The readily accessible standard control PC is integrated into the system. By eliminating the typical "no name" floor- mounted PC with its dangling cables and connectors, the System 650 retains the advantages of a single source vendor and an industry standard PC architecture.